Semiconductor

Precision Inkjet System | Micron-level Wafer Printing Solution

Three Core Printing Challenges in Semiconductor Manufacturing

  • Ultra-precision Requirement: High-accuracy NG printing for defective wafers
  • Substrate Compatibility: Damage-free printing on silicon wafer & glass substrate to eliminate thermal damage caused by laser printing
  • Cleanroom Compliance: Compatible with Class 100 cleanroom with zero risk of metal ion contamination

LIONTEC semiconductor inkjet printing system can integrate industrial vision inspection module to complete high-precision wafer dot printing as an alternative to laser printing. Multi-color inks are available to mark defective products distinctly.

Solutions:

LIONTEC provides high-precision, dust-free and clean-grade inkjet printing and functional printing solutions specially designed for semiconductor wafer fabrication, chip packaging and electronic component production lines. Adopting non-contact micro-jet printing technology, the equipment meets ultra-clean workshop standards, stable operation in constant temperature, low-dust and high-precision manufacturing environments. It replaces traditional labeling, screen printing and manual printing processes, effectively avoiding substrate damage, surface scratch and pollution problems. It fully satisfies ultra-fine printing, zero-defect production and full-life cycle traceability requirements for semiconductor chips, wafers and precision electronic devices.

Application Markets:

Silicon wafer manufacturing, IC chip packaging, semiconductor discrete devices, LED optoelectronic chips, MEMS sensors, PCB circuit boards, FPC flexible circuits, semiconductor ceramic substrates, chip carrier plates, wafer frame trays, precision electronic components, semiconductor packaging accessories and finished semiconductor products.

Printable Substrates:

Monocrystalline silicon wafer, polysilicon wafer, glass wafer, ceramic substrate, aluminum alloy fixture, stainless steel tray, FR-4 rigid PCB, FPC flexible film, plastic PP/ABS/PEEK material, chip resin encapsulation surface, copper foil, tin-plated surface, gold-plated substrate and anti-static engineering plastic.

Printing Content:

Wafer batch number, wafer SN serial number, chip model specification, production date, lot code, shift code, anti-counterfeit invisible code, two-dimensional traceability QR code, barcode, certification symbol, product parameter information, customized LOGO and customized variable data content.

Ink Features:

1. Eco-friendly formula: Non-toxic, harmless to both the environment and human health.
2. High definition: Delivers sharp, clear print with vivid, bright colors.
3. Extreme temperature resistance: Maintains excellent print quality in high-temperature and low-temperature harsh environments.
4. Strong adhesion: Offers stable, reliable bonding performance on a wide range of substrates.
5. Fast drying: Ultra-quick drying time prevents smudging and significantly improves production efficiency.
6. Chemical resistance: Marks withstand solvents such as alcohol, ensuring readability throughout production and use.
7. Anti-migration: Characters will not shift or blur under pressure or temperature changes, remaining consistently clear and legible.
8. Abrasion resistance: Marks do not fade even after repeated contact and friction, retaining their clarity.
9. Wide color range: Available in black, white, red, yellow, blue, green, invisible, UV-curable, and more, to meet diverse production requirements.

Importance of Component Printing:

1. Standardized Industrial Compliance: Professional ultra-precision printing meets semiconductor industry clean production standards and international electronic manufacturing specifications, supporting factory certification and global market access.
2. Full Lifecycle Traceability: Unique serial numbers and QR codes realize full-process traceability from wafer incoming inspection, chip packaging, testing, warehousing to finished product delivery and after-sales tracking.
3. Zero-Damage High-Precision Identification: Non-contact inkjet printing avoids pressure damage and micro-cracks on fragile wafers and precision chips, ensuring zero impact on product yield.
4. Stable and Durable Printing: Printed content resists high-temperature processing, chemical cleaning and mechanical friction during semiconductor production, maintaining long-term clarity and stability.
5. Intelligent Production Management: Variable data batch printing realizes automated production statistics, quality screening and error prevention, greatly improving production efficiency and management standardization.
6. Enhance Product Competitiveness: High-definition and standardized product printing reflects advanced manufacturing capability, helping semiconductor manufacturers improve product credibility and market competitiveness.

Applications

Fields of Application

  • Defective wafer printing
  • Multi-color ink dot printing for defect locations (replacement for laser ablation)
  • HF acid-resistant inks, compatible with wafer cleaning processes
  • Wafer ID printing for full production traceability
  • Full-edge batch code printing along wafer peripheral area
  • Printing for semiconductor chip packaging
  • Black insulating perimeter printing for chips (resistant to 300℃ reflow soldering)